文章摘要
电子封装互连SAC305微焊点剪切断裂行为的实验及数值模拟
Experimental and numerical simulation of shear fracture behaviors of SAC305 micro-scale solder joints for electronic packaging
投稿时间:2020-05-26  修订日期:2020-05-26
DOI:
中文关键词: 电子封装  铅钎料  微尺度焊点  剪切断裂
英文关键词: Electronic packaging  lead-free solder  micro-scale solder joint  shear fracture
基金项目:国家自然科学“基于多次热循环的高级别管线钢焊接粗晶区的组织演变规律及增韧机理”(51674056)、重庆市研究生科研创新项目“Sn-Ag-Cu微焊点高温剪切蠕变失效行为研究及其有限元分析”(CYS19352)、国家级大学生创新训练计划项目“热-电耦合致铜核微焊点界面化合物演变及拉伸失效行为研究”(201911551005)。
作者单位E-mail
左存果 重庆科技学院冶金与材料工程学院 1158438324@qq.com 
尹立孟 重庆科技学院冶金与材料工程学院 yeenlm@163.com 
张中文 重庆科技学院冶金与材料工程学院 269137185@qq.com 
江山 重庆科技学院冶金与材料工程学院 2453832429@qq.com 
苏子龙 重庆科技学院冶金与材料工程学院 1397132452@qq.com 
张焱 重庆科技学院冶金与材料工程学院 962130338@qq.com 
姚宗湘 重庆科技学院冶金与材料工程学院 362602004@qq.com 
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中文摘要:
      采用基于精密动态力学分析仪(DMA Q800)的准静态剪切力试验,研究了相同直径(400μm)和不同高度(125μm、225μm和235μm) “铜引线/Sn-3.0Ag-0.5Cu(SAC305)钎料/铜引线”三明治结构微焊点的剪切断裂行为,其剪切断裂强度分别为29.87 MPa、26.91 MPa和23.97 MPa。进一步采用有限元分析软件ABAQUS和Johnson-Cook本构模型深入分析125~405μm系列高度SAC305微焊点的损伤和剪切断裂行为,剪切断裂强度分别为33.87 MPa、30.42 MPa、29.85 MPa、27.46 MPa、26.92 MPa和25.43 MPa。试验和模拟结果均表明,当保持焊点直径不变,焊点高度越小,抗剪强度越强,且断裂发生在钎焊点料/铜引线界面处。
英文摘要:
      The shear fracture behaviors of “Cu/Sn-3.0Ag-0.5Cu (SAC305) solder/Cu” sandwich structured micro-scale solder joints with constant diameter (400μm) and different heights (225μm, 125μm and 235μm) was studied via the precise quasi-static shear force experiment based on Dynamic Mechanical Analyzer (DMA Q800, TA-Instruments). The shear fracture strength obtained was 29.87 MPa, 26.91 MPa and 23.97 MPa respectively. ABAQUS software and Johnson-Cook constitutive model were then used to describe the damage and fracture of lead-free solder joints. The shear fracture behavior of micro-scale solder joints with constant diameter (400μm) and different height of 125-405μm was 33.87 MPa, 30.42 MPa, 29.85 MPa, 27.46 MPa, 26.92 MPa, 25.43 MPa, respectively. The results shows that the smaller the height of the solder joint, the stronger the shear strength. In addition, under the shear loading testing, the micro-scale solder joint breaks at the interface of solder joint/copper wire, which is consistent with the simulated fracture position.
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